Manufacturing Capabilities
Cleanroom: Microelectronics
Fabrication equipment includes:
Fabrication equipment includes:
Fabrication equipment includes:
- Belt Furnaces
- Die Attach Stations
- Hot Gas Bonder
- Die Probes
- Passivation
- Wire Bond
- Cap Welders
- Seam Sealers
- DAP Assembly
Fabrication equipment includes:
- Resistance Welder
- Vapor Phase
- Encapsulation
- Belt Furnace
- DAP Sealer
- Machine Shop / CNC Machine
- Cap Welder
Wafer Fabrication
Fabrication equipment includes:
Testing / Qualification Capabilities
Fabrication equipment includes:
- Wet Chemistry Bench (Clean)
- High Temperature Diffusion Furnaces
- Varian Evaporator (Lifetime Control / Metallization)
- Die Saw / Sandblast Dicer (Wafer Dicing)
- DAP Sealer
- Glass Encapulation
- Belt Furnace
- Die Etch
MIL-PRF-19500 / MIL-STD-883 / MIL-STD-750 / MIL-STD-202 / ESA / SCC-5000 (equivalent) / MIL-M-38510 / MIL-PRF-38534
SSDI manufactures its products to the highest standards in the industry in accordance with SSDI and customer source control drawings (SCDs) for testing and screening levels in compliance with quality procedures as applicable to semiconductors.
Components
- ATE
- Hermeticity
- PIND Testing
- Reverse Energy Transient Test
- Current Surge Test
- HTRB
- Real Time X-Ray
- Parametric
- Power Burn-In
- Power Cycling
- Thermal Response
- ESD
- Pull Tester
Modules
- Corona AC & DC
- HIPOT AC & DC
- Performance Test
- Static & Dynamic
- Power Cycling
- Burn-In
- Real Time X-Ray
- Insulation Resistance
Environmental
- Temperature Cycling
- Thermal Shock
- Humidity
- High Temp Storage
- Salt Spray / Atmosphere
- Moisture Resistance
- Hot / Cold Temp Bath
- Barometric Pressure
Outside Processing
- Hermeticity
- Vibration
- Shock
- Acceleration
- RGA
- Radiography
PIND Testing
Real Time X-Ray
ATE - TESEC 3000 V, 200 A
Real Time X-Ray
ATE - TESEC 3000 V, 200 A
Fine Leak Testing
SOA / ISB / Capacitance
SOA / ISB / Capacitance
