Aerospace & Defense

Low / Medium Power Discretes Rectifiers

• 5 µs - 4 ns
• 16 V - 25 kV
• 20 mA - 3 A

Schottkys

• 30 mA - 3 A
• 20 V - 300 V

SiC Schottkys

• 500 mA - 3 A
• 15 V - 600 V

JFETs

• 100 mW - 5 W
• 10 mA - 1 A
• -30 V - 100 V

Bipolar Transistors

• 200 mW - 6 W
• 10 mA - 10 A
• 10 V - 900 V

Zeners

• 250 mW - 6 W
• 2.4 V - 510 V

TVS

• 150 W - 500 W
• 7.5 V - 510 V

High Power Discretes Rectifiers

• 3.15 A - 120 A
• 20 V - 15 kV
• 25 µs - 30 ns

Schottkys

• 4 A - 150 A
• 25 V - 300 V

SiC Schottkys

• 4 A - 40 A
• 200 V - 1700 V

Power MOSFETs & SiC MOSFETs

• 6 W - 830 W
• -110 A - 350 A
• -200 V - 1.2 kV

Power IGBTs

• 6 W - 300 W
• 10 A - 200 A
• 600 V - 1.8 kV

Bipolar Transistors

• 10 W - 600 W
• 0.5 A - 200 A
• 40 V - 450 V

GaN Power FETs

• 10.4 W - 125 W
• 6.3 A - 90 A
• 40 V - 1 kV

Zeners

• 8 W - 50 W
• 2.4 V - 510 V

TVS

• 1 kW - 120 kW
• 5.6 V - 510 V

HV Bridges & Assemblies

• Utilizes hermetic components
• Standard and custom designs available
• HiRel testing / screening
• Typical applications include Radar, TWT Communications, ECM, Pulsed Energy, Voltage Multipliers, HV Power Supplies, etc.

Doorbell Rectifiers

• Up to 15 kV and 20 A

HV Multipliers

• Up to 20 kV and 200 mA

HV Power Supplies

• Multiple configurations capable of operating up to a 1 kW (2) TWT tube missile application

HV Multiple Bridges

• Used for powering TWTs in airborne applications

HV Stick Rectifiers

• Up to 15 kV and 2 A

HV Zeners

• Reference voltage up to 12.5 kV

Miniaturized, Space Qualified, HV Bridge with Voltage Multiplier

Power Modules Material Technology

• Hermetic SMT components
• DBC substrate, 8 mil thick copper
• Rugged I/O connections
• Al/SiC base plate is electrically isolated

Performance / Features

• High thermal conductivity
• Layout optimized for circuitry and I/O
• Thermal stress relief
• Application specific solution
• Simplifies procurement with single item
• Includes power and passive components

Power Hybrids

• Full in-house design & prototype capability
• Customized functional testing
• Combination of hybrid and SMT
• Package: hermetic enclosure
• Ultrasonic Al wire bonding
• Hermetic sealing
• Gross & fine leak verification
• Screening & processing per MIL-PRF-38534