• Hyper Fast Recovery: 35 nsec Maximum • High Surge Rating • Low Reverse Leakage Current • Low Junction Capacitance • Hermetically Sealed Low Profile Package • Gold Eutectic Die Attach Available • Ultrasonic Aluminum Wire Bonds • Higher Voltages and Faster Recovery Times Available, Contact Factory • Ceramic Seal for Improved Hermeticity Available • TX, TXV, and S-Level Screening Available