• Ultrafast Recovery: 50-80 nsec Max. @ 25°C, 85-125 nsec Max. @ 100°C • Single Chip Construction • PIV to 1200 Volts • Low Reverse Leakage Current • Hermetically Sealed • For High Efficiency Applications • Available in Axial Leaded & Surface Mount versions • Metallurgically Bonded • TX, TXV, and S-Level Screening Available