• Ultrafast Recovery: 50-80 ns Max @ 25°C, 80-130 ns Max @ 100°C • Single Chip Construction • PIV to 1200 Volts • Low Reverse Leakage Current • Hermetically Sealed • For High Efficiency Applications • Metallurgically Bonded • TX, TXV, and S-Level Screening Available • Available in Surface Mount (SM) and Square Tab Surface Mount (SMS) Versions (Ref. RU0003) • Hyperfast Version available (Ref. RH0119)